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Wafer Bonding: Applications and Technology Marin Alexe

Wafer Bonding: Applications and Technology

Marin Alexe

Published June 1st 2004
ISBN : 9783540210498
Hardcover
504 pages
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 About the Book 

The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding andMoreThe topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.